- LED Light Sheet
- LED Strip
- LED Tape Light
- Edge lit LED Rigid Bar
- Backlit LED Rigid Bar
- Rigid LED Strip
- Neon LED Strip
- COB LED Strip
- Lighting Fixture
- LED Light Boxes
- Signage
- Signs & Retail Displays
Manufacturing process of LED According to the manufacturing process of LED industry chain, LED modules can be divided into upstream wafer manufacturing (production and manufacturing of single chip and epitaxial chip), midstream grain manufacturing (cutting LED grains from epitaxial chip through electrode manufacturing, platform etching, etc.) and downstream packaging (packaging grains into light-emitting devices).
The specific process flow is as follows:
1. Epitaxial wafer process substrate - structure design - buffer layer growth - n-type GaN layer growth - multiple quantum well luminescent layer growth - p-type GaN layer growth - annealing - Detection (photoluminescence, X-ray) - epitaxial wafer
2. Wafer process epitaxial wafer - Design and processing mask - photolithography - ion etching - n-type electrode (coating, annealing, etching) - p-type electrode (coating, annealing, etching)
3. Packaging process: Crystal expansion - silver paste (insulating glue) - crystal solidification - drying - bonding wire - sealing epoxy resin) - drying - half cutting - electrical performance testing - full cutting - Test sorting - packaging
- LED Strip